INTERNATIONAL PATENT: CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD., 成都海光集成电路设计有限公司 FILES APPLICATION FOR "DIE-TO-DIE INTERCONNECT-BASED SEMICONDUCTOR PACKAGE AND METHOD"

GENEVA, May 25 -- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD. (Building 3, No. 171, Hele 2nd Street, Chengdu Hi-Tech Industrial Development Zone, Sichuan Pilot Free Trade ZoneChengdu, Sichuan 610216), 成都海光集成电路设计有限公司 (中国四川省成都市（四川）自由贸易试验区成都高新区和乐二街171号3栋) filed a patent application (PCT/CN2024/096002) for "DIE-TO-DIE INTERCONNECT-BASED SEMICONDUCTOR PACKAGE AND METHOD" on May 29, 2024. With publication no. WO/2025/102672, the detail...