GENEVA, June 3 -- CEMEDINE CO., LTD. (1-11-2, Osaki, Shinagawa-ku, Tokyo1418620), セメダイン株式会社 (東京都品川区大崎１丁目１１番２号) filed a patent application (PCT/JP2024/041330) for "CURABLE COMPOSITION, COMPOUND, HEAT-RESISTANT RESIN MATERIAL, ADHESIVE, SEALING MATERIAL, POTTING AGENT, ENCAPSULANT, CARBON MATERIAL, AND PREPREG" on Nov 21, 2024. With publication no. WO/2025/110215, the details related to the patent application was published on May 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Wo...