GENEVA, March 25 -- BOO, Jae Phil (#208-1501, 185, Naejeong-ro, Bundang-guSeongnam-siGyeonggi-do 13597), 부재필 (경기도성남시분당구 내정로 185, 208동 1501호) filed a patent application (PCT/KR2024/096139) for "WAFER POLISHING HEAD OF CMP APPARATUS" on Sep 11, 2024. With publication no. WO/2025/058500, the details related to the patent application was published on Mar 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KIM, Young Sung (197-16, Wonjeok-ro, Sindun-myeonIcheon-siGyeonggi-do 1730...