GENEVA, June 16 -- BEIJING ZITIAO NETWORK TECHNOLOGY CO., LTD. (0207, 2/F, Building 4, Zijin Digital Park,Haidian District, Beijing 100190), 北京字跳网络技术有限公司 (中国北京市海淀区紫金数码园4号楼2层0207) filed a patent application (PCT/CN2024/134242) for "COOLING APPARATUS FOR MULTI-CHIP/MULTI-MODULE HEAT DISSIPATION" on Nov 25, 2024. With publication no. WO/2025/119022, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by t...