INTERNATIONAL PATENT: BEIJING TSD SEMICONDUCTOR CO., LTD., 北京特思迪半导体设备有限公司 FILES APPLICATION FOR "METHOD FOR MEASURING FILM THICKNESS IN SITU, REFERENCE SPECTRUM GENERATION METHOD AND DEVICE"

GENEVA, Dec. 8 -- BEIJING TSD SEMICONDUCTOR CO., LTD. (Building 6, No. 3, Duyang North StreetShunyi District, Beijing 101300), 北京特思迪半导体设备有限公司 (中国北京市顺义区杜杨北街3号院6号楼) filed a patent application (PCT/CN2024/135882) for "METHOD FOR MEASURING FILM THICKNESS IN SITU, REFERENCE SPECTRUM GENERATION METHOD AND DEVICE" on Nov 29, 2024. With publication no. WO/2025/246244, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) s...