INTERNATIONAL PATENT: BEIJING TSD SEMICONDUCTOR CO., LTD., 北京特思迪半导体设备有限公司 FILES APPLICATION FOR "METHOD AND DEVICE FOR DETECTING END POINT OF WAFER FILM GRINDING"

GENEVA, Feb. 15 -- BEIJING TSD SEMICONDUCTOR CO., LTD. (Building 6, No. 3, Duyang North StreetShunyi District, Beijing 101300), 北京特思迪半导体设备有限公司 (中国北京市顺义区杜杨北街3号院6号楼) filed a patent application (PCT/CN2023/126417) for "METHOD AND DEVICE FOR DETECTING END POINT OF WAFER FILM GRINDING" on Oct 25, 2023. With publication no. WO/2025/030663, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by ...