GENEVA, Nov. 23 -- BEIJING JIAOTONG UNIVERSITY (No. 3 ShangyuancunHaidian District, Beijing 100044), 北京交通大学 (中国北京市海淀区上园村3号) filed a patent application (PCT/CN2024/123825) for "HIGH-TEMPERATURE SUPERCONDUCTING COIL AND HEAT SINK ASSEMBLY THEREFOR" on Oct 10, 2024. With publication no. WO/2025/236529, the details related to the patent application was published on Nov 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MA, Tao (School of Electrical EngineeringNo. 3 Shang...