INTERNATIONAL PATENT: BEIJING JIAOTONG UNIVERSITY, 北京交通大学 FILES APPLICATION FOR "DEVICE FOR SOLDERING OF CORC HIGH-TEMPERATURE SUPERCONDUCTING CABLE COPPER-PACKAGED CONNECTOR"

GENEVA, Aug. 24 -- BEIJING JIAOTONG UNIVERSITY (No.3 ShangyuancunHaidian District, Beijing 100044), 北京交通大学 (中国北京市海淀区上园村3号) filed a patent application (PCT/CN2024/123824) for "DEVICE FOR SOLDERING OF CORC HIGH-TEMPERATURE SUPERCONDUCTING CABLE COPPER-PACKAGED CONNECTOR" on Oct 10, 2024. With publication no. WO/2025/171715, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DAI, Shaotao (School Of Elect...