INTERNATIONAL PATENT: BEIJING INSTITUTE OF SPACE MECHATRONICS & ELECTRCTY, 北京空间机电研究所, GENERAL DESIGN DEPARTMENT OF BEIJING SPACECRAFT, 北京空间飞行器总体设计部 FILES APPLICATION FOR "ARC-SHAPED STRUCTURE VACUUM HIGH AND LOW TEMPERATURE HEAT FLOW SIMULATION SYSTEM AND METHOD"

GENEVA, March 23 -- BEIJING INSTITUTE OF SPACE MECHATRONICS & ELECTRCTY (Hospital No. 104, Mittraphap RoadHaidian District, Beijing 100094), 北京空间机电研究所 (中国北京市海淀区友谊路104号院), GENERAL DESIGN DEPARTMENT OF BEIJING SPACECRAFT (Hospital No. 104, Mittraphap RoadHaidian District, Beijing 100094), 北京空间飞行器总体设计部 (中国北京市海淀区友谊路104号院) filed a patent application (PCT/CN2023/125817) for "ARC-SHAPED STRUCTURE VACUUM HIGH AND LOW TEMPERAT...