INTERNATIONAL PATENT: BEIJING EACON TECHNOLOGY CO., LTD., 北京易控智驾科技有限公司 FILES APPLICATION FOR "METHOD AND APPARATUS FOR GENERATING HIGH-DEFINITION MAP LAYER FOR REVERSE SLOPE OF SPOIL DUMP AND ELECTRONIC DEVICE"

GENEVA, April 28 -- BEIJING EACON TECHNOLOGY CO., LTD. (701B, Tower B, Dongsheng BuildingHaidian District, Beijing 100083), 北京易控智驾科技有限公司 (中国北京市海淀区东升大厦B座七层701B) filed a patent application (PCT/CN2024/113181) for "METHOD AND APPARATUS FOR GENERATING HIGH-DEFINITION MAP LAYER FOR REVERSE SLOPE OF SPOIL DUMP, AND ELECTRONIC DEVICE" on Aug 19, 2024. With publication no. WO/2025/082018, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) s...