INTERNATIONAL PATENT: ASAHI KASEI KABUSHIKI KAISHA, 旭化成株式会社 FILES APPLICATION FOR "CONJUGATED-DIENE COPOLYMER, CONJUGATED-DIENE COPOLYMER COMPOSITION, RESIN COMPOSITION, CURED OBJECT, RESIN FILM, PREPREG, LAMINATE AND MATERIAL FOR ELECTRONIC CIRCUIT BOARD"

GENEVA, Sept. 16 -- ASAHI KASEI KABUSHIKI KAISHA (1-1-2 Yurakucho, Chiyoda-ku, Tokyo1000006), 旭化成株式会社 (東京都千代田区有楽町一丁目１番２号) filed a patent application (PCT/JP2025/004396) for "CONJUGATED-DIENE COPOLYMER, CONJUGATED-DIENE COPOLYMER COMPOSITION, RESIN COMPOSITION, CURED OBJECT, RESIN FILM, PREPREG, LAMINATE, AND MATERIAL FOR ELECTRONIC CIRCUIT BOARD" on Feb 10, 2025. With publication no. WO/2025/187331, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) sys...