GENEVA, July 9 -- ARTIENCE CO., LTD. (2-1, Kyobashi 2-chome, Chuo-ku, Tokyo1040031), artience株式会社 (東京都中央区京橋二丁目2番1号) filed a patent application (PCT/JP2024/046147) for "PASTE FOR BONDING, AND BONDED BODY" on Dec 26, 2024. With publication no. WO/2025/143115, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TANAKA Naohiro (c/o artience Co....