GENEVA, April 29 -- APIC YAMADA CORPORATION (90, Ooaza Kamitokuma, Chikuma-shi, Nagano3890898), アピックヤマダ株式会社 (長野県千曲市大字上徳間90番地) filed a patent application (PCT/JP2024/037200) for "TABLET SUPPLY DEVICE, RESIN SEALING DEVICE, AND TABLET SUPPLY METHOD" on Oct 18, 2024. With publication no. WO/2025/084403, the details related to the patent application was published on Apr 24, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor...