GENEVA, April 1 -- APIC YAMADA CORPORATION (90, Ooaza Kamitokuma, Chikuma-shi, Nagano3890898), アピックヤマダ株式会社 (長野県千曲市大字上徳間９０番地) filed a patent application (PCT/JP2024/030170) for "SEALING RESIN FOR USE IN COMPRESSION MOLDING AND METHOD AND DEVICE FOR FORMING SEALING RESIN" on Aug 26, 2024. With publication no. WO/2025/062950, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organiz...