INTERNATIONAL PATENT: APIC YAMADA CORPORATION, アピックヤマダ株式会社 FILES APPLICATION FOR "RESIN SEALING METHOD, RESIN SEALING COMPONENT AND RESIN SEALING DEVICE"

GENEVA, Nov. 10 -- APIC YAMADA CORPORATION (90, Ooaza Kamitokuma, Chikuma-shi, Nagano3890898), アピックヤマダ株式会社 (長野県千曲市大字上徳間９０番地) filed a patent application (PCT/JP2025/007638) for "RESIN SEALING METHOD, RESIN SEALING COMPONENT, AND RESIN SEALING DEVICE" on Mar 04, 2025. With publication no. WO/2025/229799, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Invent...