GENEVA, June 10 -- APIC YAMADA CORPORATION (90, Ooaza Kamitokuma, Chikuma-shi, Nagano3890898), アピックヤマダ株式会社 (長野県千曲市大字上徳間９０番地) filed a patent application (PCT/JP2024/037519) for "RESIN SEALING DEVICE AND WORKPIECE SUPPLY METHOD" on Oct 22, 2024. With publication no. WO/2025/115458, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NAKAYAMA Eiji (c...