INTERNATIONAL PATENT: APIC YAMADA CORPORATION, アピックヤマダ株式会社 FILES APPLICATION FOR "RESIN ENCAPSULATION DEVICE AND RESIN ENCAPSULATION METHOD"

GENEVA, March 24 -- APIC YAMADA CORPORATION (90, Ooaza Kamitokuma, Chikuma-shi, Nagano3890898), アピックヤマダ株式会社 (長野県千曲市大字上徳間９０番地) filed a patent application (PCT/JP2024/029242) for "RESIN ENCAPSULATION DEVICE AND RESIN ENCAPSULATION METHOD" on Aug 19, 2024. With publication no. WO/2025/057660, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KAWAGU...