GENEVA, March 10 -- APIC YAMADA CORPORATION (90, Ooaza Kamitokuma, Chikuma-shi, Nagano3890898), アピックヤマダ株式会社 (長野県千曲市大字上徳間９０番地) filed a patent application (PCT/JP2024/028683) for "MOLDED PRODUCT FORMATION METHOD AND SEALING RESIN" on Aug 09, 2024. With publication no. WO/2025/047389, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WAKUI Masaaki ...