INTERNATIONAL PATENT: AJINOMOTO CO., INC., 味の素株式会社 FILES APPLICATION FOR "AROMATIC OXYCARBONYL COMPOUND, RESIN COMPOSITION, RESIN SHEET, PREPREG, CURED PRODUCT, CIRCUIT SUBSTRATE, SEMICONDUCTOR CHIP PACKAGE AND SEMICONDUCTOR DEVICE"

GENEVA, July 8 -- AJINOMOTO CO., INC. (15-1, Kyobashi 1-chome, Chuo-ku, Tokyo1048315), 味の素株式会社 (東京都中央区京橋一丁目１５番１号) filed a patent application (PCT/JP2024/044717) for "AROMATIC OXYCARBONYL COMPOUND, RESIN COMPOSITION, RESIN SHEET, PREPREG, CURED PRODUCT, CIRCUIT SUBSTRATE, SEMICONDUCTOR CHIP PACKAGE, AND SEMICONDUCTOR DEVICE" on Dec 18, 2024. With publication no. WO/2025/142671, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the W...