GENEVA, March 8 -- ACM RESEARCH (SHANGHAI) , INC. (Building 4, No. 1690 Cai Lun Road, China (shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201203), 盛美半导体设备(上海)股份有限公司 (中国上海市浦东新区中国(上海)自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2024/106106) for "WAFER DRYING DEVICE AND WAFER DRYING METHOD" on Jul 18, 2024. With publication no. WO/2025/044579, the details related to the patent application was published on Mar 06, ...