INTERNATIONAL PATENT: ACM RESEARCH (SHANGHAI),INC., 盛美半导体设备（上海）股份有限公司 FILES APPLICATION FOR "SUBSTRATE TREATMENT APPARATUS"

GENEVA, Sept. 20 -- ACM RESEARCH (SHANGHAI) , INC. (Building 4, No. 1690 Cai Lun Road, China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201203), 盛美半导体设备（上海）股份有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2025/076967) for "SUBSTRATE TREATMENT APPARATUS" on Feb 12, 2025. With publication no. WO/2025/190016, the details related to the patent application was published on Sep 18, 2025.

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