INTERNATIONAL PATENT: ACM RESEARCH (SHANGHAI),INC., 盛美半导体设备（上海）股份有限公司 FILES APPLICATION FOR "SUBSTRATE ELECTROPLATING APPARATUS AND METHOD"

GENEVA, May 4 -- ACM RESEARCH (SHANGHAI) , INC. (BUILDING 4, NO. 1690 CAI LUN ROADCHINA (SHANGHAI) PILOT FREE TRADE ZONE, Pudong New AreaShanghai 201203), 盛美半导体设备（上海）股份有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2024/122414) for "SUBSTRATE ELECTROPLATING APPARATUS AND METHOD" on Sep 29, 2024. With publication no. WO/2025/087010, the details related to the patent application was published on May 01, 20...