GENEVA, Dec. 8 -- ACM RESEARCH (SHANGHAI) , INC. (Building 4, No. 1690 Cai Lun RoadChina (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201203), 盛美半导体设备（上海）股份有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2025/091445) for "PRE-WETTING METHOD AND DEVICE FOR WAFER" on Apr 27, 2025. With publication no. WO/2025/246759, the details related to the patent application was published on Dec 04, 2025. ...