INTERNATIONAL PATENT: ACM RESEARCH (SHANGHAI),INC., 盛美半导体设备（上海）股份有限公司 FILES APPLICATION FOR "METHOD FOR IMPROVING UNIFORMITY OF WAFER ELECTROPLATING THICKNESS"

Posted On: 2025-04-05

GENEVA, April 5 -- ACM RESEARCH (SHANGHAI) , INC. (Building 4, No. 1690 Cai Lun Road, China (shanghai) Pilot Free Trade Zone, Pudong New AreaShanghai 201203), 盛美半导体设备（上海）股份有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2024/114319) for "METHOD FOR IMPROVING UNIFORMITY OF WAFER ELECTROPLATING THICKNESS" on Aug 23, 2024. With publication no. WO/2025/066713, the details related to the patent application was...

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INTERNATIONAL PATENT: ACM RESEARCH (SHANGHAI),INC., 盛美半导体设备（上海）股份有限公司 FILES APPLICATION FOR "METHOD FOR IMPROVING UNIFORMITY OF WAFER ELECTROPLATING THICKNESS"