GENEVA, July 7 -- ACM RESEARCH (SHANGHAI) , INC. (Building 4, No. 1690 Cai Lun Road, China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201203), 盛美半导体设备（上海）股份有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2024/135868) for "ELECTROPLATING DEVICE FOR SQUARE SUBSTRATE" on Nov 29, 2024. With publication no. WO/2025/139604, the details related to the patent application was published on Jul 03, 20...