INTERNATIONAL PATENT: ACM RESEARCH (SHANGHAI),INC., 盛美半导体设备（上海）股份有限公司 FILES APPLICATION FOR "ELECTROPLATING CHUCK FOR SQUARE SUBSTRATE AND ELECTROPLATING METHOD"

Posted On: 2025-10-03

GENEVA, Oct. 3 -- ACM RESEARCH (SHANGHAI) , INC. (Building 4, No. 1690 Cai Lun Road, China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201203), 盛美半导体设备（上海）股份有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2025/078254) for "ELECTROPLATING CHUCK FOR SQUARE SUBSTRATE AND ELECTROPLATING METHOD" on Feb 20, 2025. With publication no. WO/2025/200880, the details related to the patent application wa...

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INTERNATIONAL PATENT: ACM RESEARCH (SHANGHAI),INC., 盛美半导体设备（上海）股份有限公司 FILES APPLICATION FOR "ELECTROPLATING CHUCK FOR SQUARE SUBSTRATE AND ELECTROPLATING METHOD"