GENEVA, June 9 -- ACM RESEARCH (SHANGHAI), INC. (Building 4, No. 1690 Cai Lun Road, China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201203), 盛美半导体设备（上海）股份有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区蔡伦路1690号第4幢) filed a patent application (PCT/CN2024/122477) for "SUBSTRATE CLAMPING APPARATUS AND METHOD" on Sep 29, 2024. With publication no. WO/2025/112891, the details related to the patent application was published on Jun 05, 2025....