INTERNATIONAL PATENT: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., 瑞声声学科技（深圳）有限公司 FILES APPLICATION FOR "BONE CONDUCTION MEMS CHIP AND MANUFACTURING METHOD THEREFOR AND BONE CONDUCTION PACKAGING STRUCTURE HAVING BONE CONDUCTION MEMS CHIP"

Posted On: 2025-12-15

GENEVA, Dec. 15 -- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (A-Block, Nanjing University Research Center Shenzhen Branch, No. 6 Yuexing 3rd Road, South Hi-Tech Industrial Park, Nanshan District,Shenzhen, Guangdong 518057), 瑞声声学科技（深圳）有限公司 (中国广东省深圳市南山区高新区南区粤兴三道6号南京大学深圳产学研大楼A座) filed a patent application (PCT/CN2024/097643) for "BONE CONDUCTION MEMS CHIP AND MANUFACTURING METHOD THEREFOR, AND BONE CONDUCTION PACKAG...

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INTERNATIONAL PATENT: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., 瑞声声学科技（深圳）有限公司 FILES APPLICATION FOR "BONE CONDUCTION MEMS CHIP AND MANUFACTURING METHOD THEREFOR AND BONE CONDUCTION PACKAGING STRUCTURE HAVING BONE CONDUCTION MEMS CHIP"