INTERNATIONAL PATENT: A.L.M.T. CORP., 株式会社アライドマテリアル FILES APPLICATION FOR "COPPER MOLYBDENUM COMPOSITE, HEAT DISSIPATION PLATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING COPPER MOLYBDENUM COMPOSITE AND METHOD FOR MANUFACTURING HEAT DISSIPATION PLATE"

GENEVA, Oct. 5 -- A.L.M.T. CORP. (21-1, Ginza 8-chome, Chuo-ku, Tokyo1040061), 株式会社アライドマテリアル (東京都中央区銀座八丁目２１番１号) filed a patent application (PCT/JP2025/012124) for "COPPER MOLYBDENUM COMPOSITE, HEAT DISSIPATION PLATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING COPPER MOLYBDENUM COMPOSITE, AND METHOD FOR MANUFACTURING HEAT DISSIPATION PLATE" on Mar 26, 2025. With publication no. WO/2025/206004, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International...