New Delhi, Dec. 5 -- Tata Semiconductor Manufacturing, Cyient Semiconductors and global chip equipment leader Applied Materials have emerged as the lowest bidders for three key packages under the Rs.4,500-crore modernisation programme of the Semi-Conductor Laboratory (SCL) in Mohali, as the government pushes ahead with efforts to accelerate domestic semiconductor manufacturing.
The upgrade is a central component of India's semiconductor mission and aims to enhance the capabilities of the state-run wafer fabrication unit - currently the country's only public sector semiconductor facility. The electronics and IT minister reiterated that SCL will remain fully under government ownership, even as the initiative leverages private technology and service partnerships.
Tata Semiconductor Assembly and Test (TSAT) has been identified as the lowest bidder for Package 1, which involves augmenting SCL's 8-inch CMOS wafer fabrication line to improve production scale and maturity.
Hyderabad-headquartered Cyient Semiconductors has been selected as the L1 bidder for Package 2, covering supply and qualification of technology IPs and design enablement. As part of the mandate, Cyient will deliver three foundational process technologies - RF-CMOS, BCD (HV LDMOS) and CMOS Image Sensor (CIS) - used widely across automotive, industrial, energy, sensing and connectivity applications. The platforms are expected to enhance India's mature-node capability while enabling greater fab access for startups, academic research and strategic projects.
"Being technically qualified for this strategic project is a proud moment for Cyient Semiconductors and a strong validation of our engineering depth, IP portfolio and turnkey execution capabilities. Our collaboration with SCL will accelerate India's semiconductor self-reliance by delivering highly relevant, high-value silicon solutions," said Krishna Bodanapu, Executive Vice-Chairman and Managing Director, Cyient Limited.
Singapore-based Applied Materials South East Asia has emerged as the lowest bidder for Package 3, which involves deploying manufacturing execution system software and fab automation. "This initiative represents a strategic opportunity for Applied Materials. enabling world-class automation capabilities that strengthen India's position in the global semiconductor value chain," said Avi Avula, President, Applied Materials India.
All three bidders were shortlisted based on financial proposals and compliance with tender conditions. SCL is expected to commence detailed negotiations before awarding the contracts as the project enters its implementation phase under the India Semiconductor Mission.
Published by HT Digital Content Services with permission from TechCircle.