India, Jan. 12 -- IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This achievement leverages an advanced 3D SiP architecture with stacked substrates to meet the reliability standards required for space-grade electronics.By re-engineering traditional the 200 mm ' 200 mm PCB-based electronics into a compact 81 mm ' 81 mm SiP module, izmo Microsystems has realized an 84% reduction in footprint. This is achieved through the integration of active components in bare-die form onto a stacked-substrate configuration using high-density wire bonding. This approach enables high routing density and multi-function int...