Intellectual Property India Publishes Patent Application for 'Truncating The Distribution Of Modulus Properties In Natural Populations Of Wood' Filed by Inventwood Inc.

MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517020663 A) filed by Inventwood Inc., Frederick, U.S.A., on March 7, for 'truncating the distribution of modulus properties in natural populations of wood.'

Inventor(s) include Bradshaw Allan; and Winterowd Jack G.

The application for the patent was published on May 30, under issue no. 22/2025.

According to the abstract released by the Intellectual Property India: "This disclosure is directed to methods of separating wood veneer material by property measurements and thereafter improving the properties of veneer material with property values lower than a target threshold value until those materials meet or exceed that threshold values. In some asp...