MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517043406 A) filed by Max-Planck-Institut Fur Nachhaltige Materialien; and Gesellschaft Mit Beschrankter Haftung, Dusseldorf, Germany, on May 5, for 'process for the manufacturing of microscale hollow metal bodies.'
Inventor(s) include Ramachandramoorthy, Rajaprakash; and Kang, Sung-Gyu.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "A hollow body and a process for preparing a hollow body having a bottom, an upper end wall and side walls extending between the bottom and the upper end wall, characterized in that the upper end wall and side wa...