MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202517005903 A) filed by Cytiva Sweden Ab, Uppsala, Sweden, on Jan. 24, for 'heat treatment of 3d printed parts.'
Inventor(s) include Winestrom, Mikael; and Alriksson, Johan.
The application for the patent was published on March 28, under issue no. 13/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to a method (1900) for surface treatment of 3D printed parts for bioprocessing equipment, the method comprising: applying (1902) pressure to a surface (210) to be treated of a 3D printed part (200) using a contact surface (111) of an elastomeric resurfacing tool (110); heating (1904) the contac...