Intellectual Property India Publishes Patent Application for 'Bonded Seam, Method, And Device For Joining Material Webs Or Material Sheets By Means Of A Thermally Activatable Adhesive, And Use Of An Impact Press' Filed by Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung Eingetragener Verein

MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202547077485 A) filed by Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung Eingetragener Verein, Munchen, Germany, on Aug. 14, for 'bonded seam, method, and device for joining material webs or material sheets by means of a thermally activatable adhesive, and use of an impact press.'

Inventor(s) include Kott, Mathias.

The application for the patent was published on Nov. 14, under issue no. 46/2025.

According to the abstract released by the Intellectual Property India: "The invention relates to a bonded seam, a method, and a device for joining material webs (10) by means of a thermally activatable adhesive, in particular a hot-melt adhes...