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ASML, TSMC, and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration

India, June 18 -- At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, in partnership with the lit... Read More


The next cybersecurity threat may already be inside the enterprise

India, June 18 -- For years, enterprise cybersecurity was built around a familiar assumption: the threat was outside the organisation, and the objective was to prevent it from getting in. Artificial ... Read More


Why test engineering remains critical in the 2nm era?

India, June 18 -- As advanced nodes amplify complexity, deep test engineering expertise is vital to commercial success. In the current phase of semiconductor evolution, the real competitive edge lies ... Read More


Intel Foundry details process milestones and future innovation at VLSI Symposium

India, June 18 -- At the 2026 VLSI Symposium, Intel Foundry provided an update on its process roadmap and long-term innovation investments. It shared that Intel 18A‑P, the first performance enha... Read More


TSMC and Amkor announce long-term partnership to accelerate advanced packaging in USA

India, June 18 -- Taiwan Semiconductor Manufacturing Co. (TSMC)and Amkor Technology Inc. (Nasdaq: AMKR) have announced a 10-year agreement to foster a strong partnership that will enhance advanced sem... Read More


India to host SEMICON India 2026 to strengthen global semiconductor partnerships

India, June 18 -- India will host SEMICON India 2026 from 17-19 September at Yashobhoomi, India International Convention and Expo Centre in New Delhi. Jointly organized by the India Semiconductor Mis... Read More


Exclusive: Jharkhand agriculture minister Shilpi Neha Tirkey sets out the state's AI vision for farmers

India, June 18 -- Artificial intelligence (AI) could help Jharkhand address some of its most persistent agricultural challenges, from dependence on rainfall and climate variability to uneven digital a... Read More


CEA-Leti scales ferroelectric RAM to 22nm node, unlocking denser, more efficient memory for edge AI

India, June 18 -- CEA-Leti has announced a major advance in memory technology: the demonstration of ferroelectric RAM (FeRAM) scaled to the 22nm manufacturing node using an innovative 3D capacitor arc... Read More


Optical interconnects become critical to AI Factory expansion; CPO/NPO market to exceed $39bn by 2030

India, June 18 -- TrendForce's recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, hig... Read More


Thin wafer market gains momentum as semiconductor miniaturization accelerates

India, June 18 -- Global thin wafer market to grow from USD 5.2 billion in 2024 to USD 8.4 billion by 2030 as chipmakers prioritize thinner substrates for advanced packaging, high-performance electron... Read More