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Samsung unveils HBM5 model for first time at Computex, production reportedly seen around 2028

India, June 3 -- Shortly after Samsung announced HBM4E sample shipment has started, the memory giant has made another progress by showcasing a mock-up of its 8th-generation High Bandwidth Memory (HBM5... Read More


H2 Core Systems builds scalable hydrogen energy solutions with Siemens Xcelerator

India, June 3 -- Siemens has announced that H2 Core Systems, a startup focused on modular hydrogen-based energy systems, is using the Siemens Xcelerator platform of software and automation portfolio t... Read More


Foxconn's new France venture signals a shift in global chip manufacturing

India, June 3 -- Europe has spent decades building advanced aerospace systems, medical devices and telecommunications infrastructure, while relying on Asia for semiconductor assembly and testing. That... Read More


Cadence unveils industry's first fully autonomous virtual engineer for chip design, powered by NVIDIA

India, June 3 -- At Computex 2026, Cadence announced the industry's first fully autonomous virtual agentic AI design engineer, extending the ChipStack AI Super Agent to Level-5 autonomy. Built on Cad... Read More


Snowflake and Anthropic Push AI Agents Into Enterprise Workflows

India, June 3 -- Announced at Snowflake Summit 2026, the companies said enterprises are deploying Anthropic's Claude models through Snowflake Cortex AI to build AI agents and automate business workflo... Read More


Microsoft Build 2026 Day 1: Five Announcements Indian Enterprises Should Watch

India, June 3 -- Microsoft used the opening day of its Build 2026 developer conference to reveal a sweeping vision for the next phase of enterprise AI. What became evidently clear was that Microsoft ... Read More


Global semiconductor market surges beyond $1.5 trillion in 2026

India, June 3 -- World Semiconductor Trade Statistics (WSTS) has released its Spring 2026 semiconductor market forecast, significantly raising the industry outlook for both 2026 and 2027. In 2026, th... Read More


CEA-Leti presents die-to-wafer hybrid bonding at 1 μm pitch, removing bottleneck for AI hardware

India, June 3 -- CEA-Leti has announced a major milestone in the evolution of 3D integration for high-performance computing (HPC), advanced smart-vision systems and artificial intelligence (AI), demon... Read More


Cadence launches industry's first level-5 autonomous AI agent for semiconductor design

India, June 3 -- Cadence, the semiconductor design software company, has unveiled what it calls the semiconductor industry's first fully autonomous virtual AI design engineer, extending its ChipStack ... Read More


Computex 2026 biggest announcements: The good, the bad and the expensive

India, June 3 -- Computex 2026 showcased the future of AI computing, gaming and laptops. For India, some of it looks exciting, some expensive, and some potentially game-changing. Some of it will be fr... Read More