Exclusive

Publication

Byline

HI has lots of costly semiconductor chips on a package, and you don't want defects killing them

India, Sept. 17 -- There was another panel discussion around advanced packaging at the ongoing Semicon India 2026. The participants were: Tim McIntosh, VP, TSAT Business Head, Tata Electronics, Manis... Read More


Coforge COO Sunil Fernandes on redesigning IT services for AI

India, Sept. 17 -- For much of the rise of Indian IT services, growth had a fairly clear trajectory. Large multi-year global contracts created demand for more engineers, offshore delivery brought a co... Read More


Building next-gen manufacturing ecosystem: Why India's opportunity is bigger than building fabs?

India, Sept. 17 -- Shikhar Malhotra, Chairman, India Chip Pvt Ltd, delivered the keynote on advanced packaging. Six young engineers under Shiv Nadar, started a company in the 1970s. They built the fir... Read More


Growing together: India's commercial fab and the ecosystem

India, Sept. 17 -- There was a fireside chat at the ongoing Semicon India 2026 in New Delhi. The participants were: Utpal Shah, Senior VP, Strategy and Business Development, Tata Electronics, Guru Th... Read More


LightSpeed Photonics to showcase photonics and optical interconnect technologies at SEMICON India 2026

India, Sept. 17 -- LightSpeed Photonics will showcase its photonics and optical interconnect technologies live in India for the first time at SEMICON India 2026, running from September 17-19. The dem... Read More


India building semiconductor future: Emerging capabilities across design, manufacturing, packaging, materials, and talent

India, Sept. 17 -- Building on the successful implementation of Semicon 1.0, the Union Cabinet approved Semicon 2.0 on 15 July 2026 with an outlay of Rs 1,27,500 crore. While the first phase laid the... Read More


Electronics Components Manufacturing scheme: Building India's electronics backbone

India, Sept. 17 -- Electronics have become integral to modern economies and everyday life. They power communication, healthcare, transport, finance, manufacturing and digital infrastructure. From smar... Read More


MediaTek Dimensity 9600 Pro debuts with 2nm process and dual NPU

India, Sept. 17 -- In a major milestone for MediaTek, the company has officially unveiled its next-generation flagship processor, the MediaTek Dimensity 9600 Pro. Fabricated using TSMC's advanced 2nm ... Read More


electronica India and productronica India 2026 open in Bengaluru with focus on manufacturing depth and global partnerships

India, Sept. 17 -- electronica India and productronica India 2026 opened at the Bangalore International Exhibition Centre (BIEC), Bengaluru, bringing together electronics manufacturers, component supp... Read More


The new perimeter: Identity is now organisations' biggest risk

India, Sept. 17 -- The most dangerous threatsaren't just lurking outside.They are already inside the building, hiding inthe identities and access rights that most security teams do not fullyunderstand... Read More