Exclusive

Publication

Byline

Cadence intros AuraStack AI Super Agent -- world's first Agentic AI platform for PCB and advanced packaging

India, July 18 -- Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design,... Read More


NVIDIA next-gen Rosa CPU may adopt TSMC A16 with back-side power delivery, eyes 2028 launch

India, July 18 -- NVIDIA is expanding its AI server platform strategy beyond GPUs to CPUs, with its next-generation Rosa CPU emerging as a key focus. According to Commercial Times, Rosa may use TSMC'... Read More


embedUR systems spins out ModelNova to accelerate Edge AI development lifecycles

India, July 18 -- ModelNova, an Edge AI company from embedUR systems, today announced its full-scale launch as an independent company dedicated to making artificial intelligence practical on power-eff... Read More


IEEE study reveals energy-efficient high-speed cryogenic-VCSEL optical interconnects

India, July 18 -- Infrared focal plane arrays (FPAs) are image sensors that detect and convert infrared light into electrical signals to generate real-time thermal images. Advances in cryogenic FPAs ... Read More


Niche demand and MLC migration to drive SLC NAND prices up 120-170% in 2H26

India, July 18 -- TrendForce's recent memory pricing survey shows that more mature NAND process capacity is being shifted toward higher-value products like high-layer-count 3D NAND, leading to a signi... Read More


MicroVision Semiconductor to expand advanced ASIC development and mixed-signal design capabilities

India, July 18 -- MicroVision Inc., a leader in advanced perception solutions for industrial, security and defense, and automotive applications, announced the launch of MicroVision Semiconductor Inc.,... Read More


AI demand for high-end MLCCs drives Japan and Korea suppliers' book-to-bill ratios to post-pandemic highs

India, July 18 -- TrendForce's latest MLCC industry research indicates that accelerating AI server platform upgrades and the continued volume growth of custom ASICs developed by CSPs have significantl... Read More


imec roadmap extends to A3 by 2038; Chip density gains shift beyond traditional transistor scaling

India, July 18 -- Leading semiconductor research institute imec has unveiled its latest process roadmap, signaling a major shift in the evolution of advanced chips. According to TechNews, citing Tom's... Read More


Materials shaping the future of advanced semiconductor packaging

India, July 18 -- As semiconductor packaging technologies evolve, 2.5D packaging and 3D Cu-Cu hybrid bonding are becoming essential routes to higher performance and improved power efficiency. However,... Read More


Daily weather tracker: Red alert for rain in West Bengal-Sikkim, Orange alert in Uttarakhand and Northeast; humid heat to persist in several states

India, July 18 -- West Bengal and Sikkim remain under Red Alert as extremely heavy rainfall is expected in several areas due to active monsoon systems. Uttarakhand, Assam, Meghalaya and Chhattisgarh ... Read More