US Patent Issued to Sony Semiconductor Solutions on Sept. 15 for "Semiconductor chip and manufacturing method therefor, semiconductor device and manufacturing method therefor, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,169, issued on Sept. 15, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Semiconductor chip and manufacturing metho... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Image sensor including multi-spectral filter and electronic device including the image sensor" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,170, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Image sensor including multi-spectral filt... Read More

US Patent Issued to Sony Semiconductor Solutions on Sept. 15 for "Imaging element with transmissive cover body and diffractive lens, imaging device with transmissive cover body and diffractive lens, and method for manufacturing imaging element with transmissive cover body and diffractive lens" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,171, issued on Sept. 15, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Imaging element with transmissive cover bo... Read More

US Patent Issued to Sony Semiconductor Solutions on Sept. 15 for "Solid-state imaging device and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,172, issued on Sept. 15, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Solid-state imaging device and electronic ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Semiconductor device manufacturing method and semiconductor device manufactured using the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,173, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device manufacturing method ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Image sensor and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,174, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Image sensor and method of fabricating ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Image sensor and method of manufacturing image sensor" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,175, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Image sensor and method of manufacturin... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Image sensor including stacked chips" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,176, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Image sensor including stacked chips" was ... Read More

US Patent Issued to TDK on Sept. 15 for "Electronic device member and electronic devices" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,177, issued on Sept. 15, was assigned to TDK Corp. (Tokyo). "Electronic device member and electronic devices" was invented by Maiko Kokubo... Read More

US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on Sept. 15 for "Method for treating a photovoltaic module by light soaking" (French Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,178, issued on Sept. 15, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Method for treating a ph... Read More

• ««
• «
• 97449
• 97450
• 97451
• 97452
• 97453
• 97454
• 97455
• 97456
• 97457
• 97458
• »
• »»