ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,148, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Dummy metal-insulator-metal str... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,205, issued on July 14, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Delamination/cracking improvement at solder joints in microelect... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,207, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor device package with wettable flanks" was invented b... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,208, issued on July 14, was assigned to Resonac Corp. (Tokyo). "Method for manufacturing semiconductor device including disposing an adhesi... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,149, issued on July 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Backside deep trench capacitor and inductor structur... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,150, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Extended via connect for pixel arra... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,151, issued on July 14, was assigned to Huawei Technologies Co. LTD. (Shenzhen, China). "Semiconductor device and manufacturing method ther... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,152, issued on July 14, was assigned to Super Micro Computer Inc. (San Jose, Calif.). "Mesh inductors and antennas of electronic assemblies... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,153, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Sensor for thermal dissipation measurement" ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,154, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Jongg... Read More