US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Dummy metal-insulator-metal structures within vias" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,148, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Dummy metal-insulator-metal str... Read More

US Patent Issued to Qorvo US on July 14 for "Delamination/cracking improvement at solder joints in microelectronics package" (Texas, Florida Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,205, issued on July 14, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Delamination/cracking improvement at solder joints in microelect... Read More

US Patent Issued to TEXAS INSTRUMENTS on July 14 for "Semiconductor device package with wettable flanks" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,207, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor device package with wettable flanks" was invented b... Read More

US Patent Issued to Resonac on July 14 for "Method for manufacturing semiconductor device including disposing an adhesive thermal insulation material on the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,208, issued on July 14, was assigned to Resonac Corp. (Tokyo). "Method for manufacturing semiconductor device including disposing an adhesi... Read More

US Patent Issued to Murata Manufacturing on July 14 for "Backside deep trench capacitor and inductor structures" (California, Texas Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,149, issued on July 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Backside deep trench capacitor and inductor structur... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Extended via connect for pixel array" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,150, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Extended via connect for pixel arra... Read More

US Patent Issued to Huawei Technologies on July 14 for "Semiconductor device and manufacturing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,151, issued on July 14, was assigned to Huawei Technologies Co. LTD. (Shenzhen, China). "Semiconductor device and manufacturing method ther... Read More

US Patent Issued to Super Micro Computer on July 14 for "Mesh inductors and antennas of electronic assemblies" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,152, issued on July 14, was assigned to Super Micro Computer Inc. (San Jose, Calif.). "Mesh inductors and antennas of electronic assemblies... Read More

US Patent Issued to International Business Machines on July 14 for "Sensor for thermal dissipation measurement" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,153, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Sensor for thermal dissipation measurement" ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,154, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Jongg... Read More

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