US Patent Issued on July 21 for "Single phase liquid immersion cooling system with forced cooling circuit" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,162, issued on July 21. "Single phase liquid immersion cooling system with forced cooling circuit" was invented by Fang-Shou Lee (Taoyuan, ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Automatic leveling immersion cooling tank and method of operating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,163, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Automatic leveling immersion coolin... Read More

US Patent Issued to BULL, LE COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on July 21 for "Heat sink for active compute blade connector" (French Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,164, issued on July 21, was assigned to BULL SAS (Les Clayes sous Bois, France) and LE COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALT... Read More

US Patent Issued to AMD DESIGN on July 21 for "Manifold system for computing assembly" (New Jersey, Washington, Texas Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,165, issued on July 21, was assigned to AMD DESIGN LLC (Wilmington, Del.). "Manifold system for computing assembly" was invented by Robert ... Read More

US Patent Issued to DENSO on July 21 for "Cooling device" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,166, issued on July 21, was assigned to DENSO Corp. (Kariya-city, Japan). "Cooling device" was invented by Kimio Kohara (Kariya-city, Japan... Read More

US Patent Issued to ASIA VITAL COMPONENTS on July 21 for "Support structure of heat dissipation unit" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,167, issued on July 21, was assigned to ASIA VITAL COMPONENTS Co. LTD. (New Taipei City, Taiwan). "Support structure of heat dissipation un... Read More

US Patent Issued to Micron Technology on July 21 for "Memory sub-system enclosure" (Indian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,168, issued on July 21, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory sub-system enclosure" was invented by Suresh Reddy Y... Read More

US Patent Issued to LENOVO (SINGAPORE) on July 21 for "Heat radiation structure, electronic apparatus, and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,169, issued on July 21, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore). "Heat radiation structure, electronic apparatus, and meth... Read More

US Patent Issued to Henkel on July 21 for "Abrasion-resistant coatings for thermal interfaces" (California, Michigan, Minnesota Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,170, issued on July 21, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany). "Abrasion-resistant coatings for thermal interfaces" w... Read More

US Patent Issued to FOSHAN SHUNDE MIDEA ELECTRIC SCIENCE AND TECHNOLOGY, GD MIDEA AIR-CONDITIONING EQUIPMENT on July 21 for "Electric control component, air conditioner having same, and assembly method for electric control component" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,171, issued on July 21, was assigned to FOSHAN SHUNDE MIDEA ELECTRIC SCIENCE AND TECHNOLOGY Co. LTD. (Shunde, China) and GD MIDEA AIR-CONDIT... Read More

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