US Patent Issued to Tokyo Electron on July 14 for "Plasma processing method and plasma processing system" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,054, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing method and plasma processing system" was invented b... Read More

US Patent Issued to Tokyo Electron on July 14 for "Semiconductor devices and methods of manufacturing the same" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,055, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Semiconductor devices and methods of manufacturing the same" was inve... Read More

US Patent Issued to SCREEN Holdings on July 14 for "Substrate treating method and substrate treating apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,056, issued on July 14, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treating method and substrate treating apparatu... Read More

US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on July 14 for "Semiconductor device and method of forming thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,057, issued on July 14, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Semiconductor device and method of forming th... Read More

US Patent Issued to FUJIFILM on July 14 for "Polishing liquid and chemical mechanical polishing method" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,058, issued on July 14, was assigned to FUJIFILM Corp. (Tokyo). "Polishing liquid and chemical mechanical polishing method" was invented by... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Semiconductor device and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,059, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More

US Patent Issued to TEXAS INSTRUMENTS on July 14 for "Methods of separating semiconductor dies" (Texas Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,060, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Methods of separating semiconductor dies" was invented by Michael... Read More

US Patent Issued to ASM IP Holding on July 14 for "Apparatus and method for removal of oxide and carbon from semiconductor films in a single processing chamber" (Arizona, Massachusetts Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,061, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Apparatus and method for removal of oxide and carbon fr... Read More

US Patent Issued to SCREEN HOLDINGS on July 14 for "Substrate cleaning device and substrate cleaning method" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,062, issued on July 14, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Substrate cleaning device and substrate cleaning method" was inv... Read More

US Patent Issued to EBARA on July 14 for "Pre-wet module" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,063, issued on July 14, was assigned to EBARA Corp. (Tokyo). "Pre-wet module" was invented by Mitsutoshi Yahagi (Tokyo). According to the ... Read More

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