Turkey, March 4 -- Ericsson and Turkcell have signed a Memorandum of Understanding (MoU) at Mobile World Congress 2026, Barcelona, Spain, to pioneer the future of telecommunications through a dedicate... Read More
Finland, March 4 -- Nokia announced a collaboration with Telia Finland to co-create on AI-RAN-based use cases. Both companies will jointly develop and test use cases on AI-driven Radio Access Network ... Read More
Japan, March 4 -- Mitsubishi Electric Corporation announced that it has signed a memorandum of understanding (MOU) with Lockheed Martin (NYSE: LMT), a U.S.-based global defense technology company, to ... Read More
Japan, March 4 -- Mitsubishi Electric Corporation announced that it has invested 50 million euros in PAYLOAD AEROSPACE, S.A. (PLD Space), a Spanish launch service provider, to collaborate on small-sat... Read More
Japan, March 4 -- Panasonic Corporation announced that its Heating & Ventilation A/C Company (hereinafter referred to as Panasonic) began accepting orders in the European market from March 4, 2026, fo... Read More
Japan, March 4 -- Panasonic Industry Co., Ltd. will invest approximately 7.5 billion yen into Panasonic Industrial Devices Materials (Guangzhou) Co., Ltd. (Guangzhou Factory), to add an additional pro... Read More
Italy, March 4 -- MAIRE (MAIRE.MI) announces that NEXTCHEM, through its subsidiaries Stamicarbon and KT Tech, has been awarded licensing, process design package (PDP) and critical equipment supply con... Read More
India, March 4 -- Great Eastern Shipping Company has contracted to buy a secondhand Kamsarmax Dry Bulk Carrier of about 81,094 dwt on 04 March 2026. The 2014 Japanese built vessel is expected to join ... Read More
India, March 4 -- LTM has been recognized as a Leader in the 'Overall' market segment in the NelsonHall NEAT Evaluation for GenAI & Process Automation in Banking 2025.In the NEAT framework, Leaders ar... Read More
China, March 4 -- China based DAITRON CO., LTD. has secured contract from Beijing Advance Optoelectronic Co., Ltd (BAOE) for Procurement of 4197-254BJLCGD001/15 Beijing Information Optoelectronic Chip... Read More