US Patent Issued to FUJIMI on May 19 for "Polishing composition, polishing method, and method for producing semiconductor substrate" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,743, issued on May 19, was assigned to FUJIMI Inc. (Kiyosu, Japan). "Polishing composition, polishing method, and method for producing semic... Read More

US Patent Issued to Fujifilm Electronic Materials U.S.A. on May 19 for "Polishing compositions and methods of use thereof" (Taiwanese, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,744, issued on May 19, was assigned to Fujifilm Electronic Materials U.S.A. Inc. (N. Kingstown, R.I.). "Polishing compositions and methods o... Read More

US Patent Issued to Worthen Industries on May 19 for "Radiation curable primer adhesive" (New Hampshire Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,745, issued on May 19, was assigned to Worthen Industries (Nashua, N.H.). "Radiation curable primer adhesive" was invented by Bob Chang (Nas... Read More

US Patent Issued to Billerud Aktiebolag on May 19 for "Paper product for flow wrapping" (Swedish Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,746, issued on May 19, was assigned to Billerud Aktiebolag (publ) (Solna, Sweden). "Paper product for flow wrapping" was invented by Thomas ... Read More

US Patent Issued to SHIN-ETSU CHEMICAL on May 19 for "Ultraviolet curable silicone adhesive composition and cured product of same" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,747, issued on May 19, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Ultraviolet curable silicone adhesive composition and cured pro... Read More

US Patent Issued to Xinmei Fontana Holding (Hong Kong) on May 19 for "Pressure-sensitive adhesive" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,748, issued on May 19, was assigned to Xinmei Fontana Holding (Hong Kong) Ltd. (Hong Kong). "Pressure-sensitive adhesive" was invented by By... Read More

US Patent Issued to TATSUTA ELECTRIC WIRE & CABLE on May 19 for "Conductive adhesive layer" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,749, issued on May 19, was assigned to TATSUTA ELECTRIC WIRE & CABLE Co. LTD. (Osaka, Japan). "Conductive adhesive layer" was invented by Yu... Read More

US Patent Issued to ExxonMobil Technology and Engineering on May 19 for "Adhesive compositions" (British, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,750, issued on May 19, was assigned to ExxonMobil Technology and Engineering Co. (Spring, Texas). "Adhesive compositions" was invented by Ja... Read More

US Patent Issued to Avery Dennison on May 19 for "Two stage methods for processing adhesives and related compositions" (Pennsylvania, Ohio Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,751, issued on May 19, was assigned to Avery Dennison Corp. (Mentor, Ohio). "Two stage methods for processing adhesives and related composit... Read More

US Patent Issued to FUJIFILM on May 19 for "Epoxy resin adhesive for medical device and cured product of the same, and medical device member and medical device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,752, issued on May 19, was assigned to FUJIFILM Corp. (Tokyo). "Epoxy resin adhesive for medical device and cured product of the same, and m... Read More

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