US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on April 21 for "Single switch direct cooling assemblies and related methods" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,818, issued on April 21, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Single switch direct cooling assemb... Read More

US Patent Issued to Adeia Semiconductor Bonding Technologies on April 21 for "Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same" (North Carolina, California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,819, issued on April 21, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Integrated cooling assemblies ... Read More

US Patent Issued to PC KRAUSE AND ASSOCIATES on April 21 for "Power module thermal management system" (Indiana Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,820, issued on April 21, was assigned to PC KRAUSE AND ASSOCIATES INC. (West Lafayette, Ind.). "Power module thermal management system" wa... Read More

US Patent Issued to HUAWEI TECHNOLGOIES on April 21 for "Chip apparatus and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,821, issued on April 21, was assigned to HUAWEI TECHNOLGOIES Co. LTD. (Shenzhen, China). "Chip apparatus and electronic device" was invent... Read More

US Patent Issued to Intel on April 21 for "Readily assembled/disassembled cooling assembly for immersion cooled semiconductor chip package" (American, Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,822, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Readily assembled/disassembled cooling assembly for immersion... Read More

US Patent Issued to PRAGMATIC SEMICONDUCTOR on April 21 for "Flexible electronic circuits with support structures" (British Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,823, issued on April 21, was assigned to PRAGMATIC SEMICONDUCTOR Ltd. (Cambridge, Great Britain). "Flexible electronic circuits with suppo... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Method for forming electrostatic discharge protection circuit comprising plurality of ESD units for protecting electronic products" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,824, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method for forming electrostatic discharge pro... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,825, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Juns... Read More

US Patent Issued to SHANGHAI XIANFANG SEMICONDUCTOR, NATIONAL CENTER FOR ADVANCED PACKAGING on April 21 for "Wafer-level chip structure, multiple-chip stacked and interconnected structure and fabricating method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,826, issued on April 21, was assigned to SHANGHAI XIANFANG SEMICONDUCTOR Co. LTD. (Shanghai) and NATIONAL CENTER FOR ADVANCED PACKAGING Co.... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on April 21 for "Semiconductor structure and method for manufacturing same" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,827, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure and method for ma... Read More

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