US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Integrated circuit device including a via power rail extending through device isolation film" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,466, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit device including a via po... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Sept. 1 for "Manufacturing method of semiconductor structure and semiconductor structure" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,467, issued on Sept. 1, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Manufacturing method of semiconductor struc... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Interconnect structure pattern" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,468, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interconnect structure pattern" was... Read More

US Patent Issued to Sony Semiconductor Solutions, Taiwan Semiconductor Manufacturing on Sept. 1 for "Semiconductor device" (Japanese, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,469, issued on Sept. 1, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan) and Taiwan Semiconductor Manufacturing Co Ltd (... Read More

US Patent Issued to Nuvoton Technology on Sept. 1 for "Sensing device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,470, issued on Sept. 1, was assigned to Nuvoton Technology Corp. (Hsinchu Science Park, Taiwan). "Sensing device and manufacturing method t... Read More

US Patent Issued to NANYA TECHNOLOGY on Sept. 1 for "Semiconductor device with filling layer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,471, issued on Sept. 1, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with filling layer and meth... Read More

US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Sept. 1 for "Tapered antifuse" (New York, Utah Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,472, issued on Sept. 1, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Tapered antifuse" was invented by Ashim Dutt... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Decoupling integrated circuit" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,473, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Decoupling integrated circuit" was invent... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,474, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Young... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Semiconductor packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,475, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor packages and methods ... Read More

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