Exclusive

Publication

Byline

Location

LTM launches AI 1000 to build pipeline of forward deployed engineers

India, June 13 -- LTM has launched AI 1000, a workforce transformation initiative aimed at developing more than 1,000 artificial intelligence (AI)-certified engineers, including forward deployed engin... Read More


GlobalFoundries to manufacture Fermionic RF chips, marking first Indian semiconductor production partnership

India, June 12 -- GlobalFoundries will produce radio frequency (RF) chips for government-backed Fermionic under a partnership. Fermionic's RF chips will be the first Indian semiconductors to be manuf... Read More


NVIDIA cuts Vera CPU memory configuration, highlighting persistent LPDRAM supply constraints and rising long-term demand

India, June 12 -- NVIDIA has decided to halve the SOCAMM memory capacity of its next-generation Vera Rubin Superchip modules, according to TrendForce's latest findings. This adjustment does not refle... Read More


Can smarter compute solve AI's data centre energy problem?

India, June 12 -- The rapid rise of artificial intelligence (AI), and its growing presence across industries and everyday life, has raised concerns about its energy requirements. Large data centres op... Read More


Publicis Sapient launches Sapient Sustain for AI-led IT operations

India, June 12 -- Publicis Sapient has launched Sapient Sustain, an artificial intelligence (AI)-enabled platform designed to help enterprises automate IT operations, reduce operational debt, and impr... Read More


The new software stack: How AI is changing SaaS, apps, and enterprise workflows

India, June 12 -- For more than two decades, the enterprise software stack followed a familiar structure. Companies bought applications for finance, human resources, customer management, supply chains... Read More


Race to 400-layer NAND: Roadmaps and key technologies driving Samsung, SK hynix, and Kioxia

India, June 12 -- As SK hynix reportedly targets mass production of 375-layer NAND by year-end, according to The Elec, the 400-layer threshold is increasingly seen as a key technical frontier in advan... Read More


Face-palming on AI failures? Watch out for Tech-Debt

India, June 12 -- Aamir Sait, VP, India, MondoDB picks out some pieces of the AI pilot-to-production puzzle in this interview where he argues why and how the right data strategy, modernisation efforts... Read More


Sterling and Wilson, Shinsung E&G ink MoU for semiconductor, battery, and display fabrication facilities

India, June 12 -- Sterling and Wilson Pvt Ltd, one of India's leading MEP and EPC companies, has announced the signing of a Memorandum of Understanding (MoU) with Shinsung E&G, one of the oldest HVAC ... Read More


SK hynix advances DRAM and NAND roadmaps; Targets 3x wafer output by 2034, 375-layer NAND at year-end

India, June 12 -- While SK hynix had only last week outlined plans to double capacity over the next five years, the memory giant is now signaling an even more aggressive expansion across both DRAM and... Read More