Japan, Aug. 18 -- LION CORP has got intellectual property rights for 'DENTIFRICE COMPOSITION.' Other related details are as follows: Application Number: JP,2022-153403 Category (FI): A61Q11/00,A61K8... Read More
Japan, Aug. 18 -- HYUNDAI MOBIS CO LTD has got intellectual property rights for 'FUEL CELL SYSTEM AND CONTROL METHOD THEREOF.' Other related details are as follows: Application Number: JP,2022-212112... Read More
Japan, Aug. 18 -- KOMATSU LTD has got intellectual property rights for 'NC PROGRAM AND RECORDING MEDIUM.' Other related details are as follows: Application Number: JP,2022-151209 Category (FI): G05B... Read More
Japan, Aug. 18 -- PANASONIC CONNECT CO LTD has got intellectual property rights for 'WIRELESS COMMUNICATION SYSTEM, BASE STATION CONTROL DEVICE, AND BASE STATION CONTROL METHOD.' Other related details... Read More
Japan, Aug. 18 -- TOSHIBA TEC CORP has got intellectual property rights for 'INKJET HEAD AND HEAD CONTROL CIRCUIT.' Other related details are as follows: Application Number: JP,2022-146399 Category ... Read More
Japan, Aug. 18 -- JAPAN FINE CERAMICS CENTER has got intellectual property rights for 'CRYSTAL DEFECT EVALUATION APPARATUS, CRYSTAL DEFECT EVALUATION METHOD, COMPUTER PROGRAM FOR CRYSTAL DEFECT EVALUA... Read More
Japan, Aug. 18 -- LY CORP has got intellectual property rights for 'ANIMAL COMMUNICATION DEVICE, ANIMAL COMMUNICATION METHOD, AND PROGRAM.' Other related details are as follows: Application Number: J... Read More
Japan, Aug. 18 -- SHINKAWA LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND MANUFACTURING METHOD.' Other related details are as follows: Application Numb... Read More
Japan, Aug. 18 -- SATO HOLDINGS CORP has got intellectual property rights for 'ARTICLE MANAGEMENT SYSTEM, DETECTION METHOD, DETECTION TOOL.' Other related details are as follows: Application Number: ... Read More
Japan, Aug. 18 -- MITSUI CHEMICALS TOHCELLO INC has got intellectual property rights for 'ADHESIVE MATERIAL FOR TEMPORARY FIXATION AND METHOD OF MANUFACTURING WAFER USING THE ADHESIVE MATERIAL FOR TEM... Read More