Publication

Byline

Location

US Patent Issued to NIPPON A&L on Jan. 27 for "Graft copolymer resin" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,557, issued on Jan. 27, was assigned to NIPPON A&L INC. (Osaka, Japan). "Graft copolymer resin" was invented by Kazuto Akaki (Niihama, Japa... और पढ़ें


US Patent Issued to Becton Dickinson and Co. on Jan. 27 for "Blood sample management using open cell foam" (New Jersey, Pennsylvania Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,061, issued on Jan. 27, was assigned to Becton Dickinson and Co. (Franklin Lakes, N.J.). "Blood sample management using open cell foam" was... और पढ़ें


US Patent Issued to FANUC on Jan. 27 for "Numerical control device, machining system simulator, and numerical control program" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,791, issued on Jan. 27, was assigned to FANUC Corp. (Yamanashi, Japan). "Numerical control device, machining system simulator, and numerica... और पढ़ें


US Patent Issued to DONGWOO FINE-CHEM, KREEMO on Jan. 27 for "Antenna package and display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,311, issued on Jan. 27, was assigned to DONGWOO FINE-CHEM Co. LTD. (Jeollabuk-Do, South Korea) and KREEMO INC. (Seoul, South Korea). "Anten... और पढ़ें


US Patent Issued to International Business Machines on Jan. 27 for "Fully-aligned and dielectric damage-less top via interconnect structure" (Chinese, American Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,785, issued on Jan. 27, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Fully-aligned and dielectric damage-less top... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Integrated circuit including connection line" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,581, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit including connection line... और पढ़ें


US Patent Issued to InterDigital Patent Holdings on Jan. 27 for "Efficient buffer management in multi-hops data forwarding" (New York, Pennsylvania, New Jersey Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,165, issued on Jan. 27, was assigned to InterDigital Patent Holdings Inc. (Wilmington, Del.). "Efficient buffer management in multi-hops da... और पढ़ें


US Patent Issued to ANTUREC PHARMACEUTICALS on Jan. 27 for "Composition comprising tTF-NGR for use in treating soft-tissue sarcoma" (German Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,399, issued on Jan. 27, was assigned to ANTUREC PHARMACEUTICALS GMBH (Frankfurt am Main, Germany). "Composition comprising tTF-NGR for use ... और पढ़ें


US Patent Issued to NATIONAL CHENG KUNG UNIVERSITY on Jan. 27 for "Food detection system and food detection method" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,423, issued on Jan. 27, was assigned to NATIONAL CHENG KUNG UNIVERSITY (Tainan, Taiwan). "Food detection system and food detection method" ... और पढ़ें


US Patent Issued to Sony Semiconductor Solutions on Jan. 27 for "Imaging element, laminated imaging element, and solid-state imaging device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,604, issued on Jan. 27, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Imaging element, laminated imaging element, ... और पढ़ें