ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,203, issued on Aug. 25. "Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps" was... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,204, issued on Aug. 25, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Method for manufacturing a package st... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,205, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Solder reflow apparatus and method of manufa... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,206, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-chu, Taiwan). "Bump-on-trace design for enlarge b... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,207, issued on Aug. 25, was assigned to HITACHI POWER SEMICONDUCTOR DEVICE LTD. (Ibaraki, Japan). "Semiconductor device including semicondu... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,208, issued on Aug. 25, was assigned to Nippon Micrometal Corp. (Saitama, Japan). "Bonding wire for semiconductor devices" was invented by ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,209, issued on Aug. 25, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Yuki Nakano (Kyoto, Japan). A... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,210, issued on Aug. 25, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure and fabrication met... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,211, issued on Aug. 25, was assigned to MITSUI KINZOKU COMPANY Ltd. (Tokyo). "Method for producing wiring board" was invented by Yukiko Kit... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,212, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Tsunehisa Ono (Kyoto, Japan). ... Read More